Job Information
Texas Instruments Field Applications Engineer - Connectivity in Shenzhen, China
Description
The Field Applications Engineer Connectivity (FAEC) is responsible for partnering with Sales and providing Connectivity related technical expertise throughout the sales cycle. The FAEC proactively identifies current products and/or creative solutions to solve existing customer projects and create new functionality/opportunities. Also in this role, the FAEC uses in-depth product knowledge to provide technical expertise to gain credibility and develop relationships with customers.
In this role, your responsibilities include:
Help TI secure customer commitments and win business by working on-site with customers in support of their engineering teams developing applications
Recommend and implement system solutions to customers in a consultative role
Develop custom applications and example code for key customers; debug software components in the customers end systems
Work closely with the sales team and product group to capture connectivity business and successfully take it to revenue
Take customer designs to revenue by providing prompt and thorough support for on-going design activity
Understand the competitive landscape; constantly applying lessons from customer engagement to refine this competitive understanding
Use competitive knowledge to tailor feedback to the product group for new product/feature development
Understand the specific business benefits that such feature/product enhancements will produce
Define and develop software and systems application notes and collateral for the above mentioned devices
Present at TI technical conferences and facilitate product specific customer trainings (seminars/workshops)
Qualifications
Minimum requirements:
Bachelor’s degree in EE/Comp Eng, or comparable
Minimum 3 years of relevant experience
Preferred qualifications:
Strong verbal and written communication skills
Strong presentation skills, with ability to effectively relate materials to customers
Demonstrated strong analytical and problem solving skills
Experienced on wireless connectivity technologies, e.g. WiFi, BT, Zigbee etc.
Familiar with MCU product and experience on technical support.
Experience on TI’s connectivity product will be a plus.
Ability to work in teams and collaborate effectively with people in different functions
Ability to take the initiative and drive for results
Strong time management skills that enable on-time project delivery
Ability to work effectively in an interrupt-driven, fast-paced and rapidly changing environment
Demonstrated ability to build strong, influential relationships
Ability to efficiently context-switch between multiple concurrent tasks
Ability to advocate for customer needs (with an understanding of “why”) back into the TI product groups
Status Regular
Job: Sales
Primary Location: CN-CN-Shenzhen
Other Locations: CN-CN-Shanghai
Work Locations: Shenzhen > China, Shenzhen Shenzhen 518057
Req ID: 240006EV