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Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves diverse high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our diverse and innovative team is helping connect, protect and power our planet.

We are looking for a Senior Electrical Module/Packaging Design Engineer responsible for the development of innovative, cutting-edge RF/Microwave module/packaged products. This will involve design and development of single or multi-chip modules that would integrate GaN, GaAs or Silicon based MMICs in various type of advanced state-of-the-art packaging technologies. Additionally, depending on experience level, a portion of your time could be involved in mentoring other team members in contributing new and innovative design ideas. You will be a key member of an integrated product development team that includes marketing, program management, mechanical engineering, product engineering, package engineering, test engineering, applications engineering, manufacturing, operations, quality and reliability, and senior management.

RESPONSIBILITIES:

• Individual Contributor for RF/mm-wave single or multi-chip module (MCM) based product development.
• Integrate MMIC(s) into air cavity or over molded modules towards innovative product solutions.
• Advanced package design using 2.5D and 3D electromagnetic simulators.
• Product checkout, optimization, and design verification testing (DVT) in the test lab.
• Execute DVT analysis and present results to the internal and/or external customer.
• Support product through critical lifecycle stages including concept/feasibility, development, qualification, and production.

REQUIRED TECHNICAL QUALIFICATIONS AND EXPERIENCE:

• Experience in integrating microwave/millimeter-wave MMIC dies such as amplifiers, switches, phase shifters, attenuators, etc. in single or multichip air-cavity or over-mold transmit/receive front-end modules (FEMs).
• Expert-level user in 3D EM simulation tools such as HFSS and/or Analyst and knowledge of one or more of the following: ADS, Microwave Office (MWO) or Cadence (Spectre) circuit simulators.
• Expert in analyzing performance tradeoffs of FEMs using various package types such as AC/OVM QFN, laminates, FCBGA, LGA, etc.
• Strong understanding of electromagnetic theory and RF fundamentals such as s-parameters, impedance matching, transmission lines, design of passive structures such as couplers, etc.
• Hands on experience in microwave measurements, characterization, and calibration methods.
• Knowledge of advanced semiconductor technologies such as GaN, GaAs and/or Silicon.
• Broad knowledge of semiconductor RF / power packaging, materials and assembly processes supporting infrastructure and defense electronic assemblies and sub-assemblies.
• Strong written and oral communication skills with the ability to concisely summarize highly technical concepts.

DESIRED EXPERIENCE:

• Knowledge of RF signal chain and system analysis is a plus.
• Knowledge of antenna design is a plus.
• Published author in technical journals and/or magazines.
• Strong ability to meet customer technical needs and schedules.

REQUIRED EDUCATION AND EXPERIENCE:

• BS Electrical Engineering with 8 or more years of experience
• MS Electrical Engineering with 5 or more years of experience
• PhD Electrical Engineering (with RF/Microwave focus) with 2-3+ years of experience

Work Location: Preferred location: Richardson, TX.; Additional locations: CA, MA, NC, CO, AZ

Relocation Eligible: Yes

This osition is not eligible for visa sponsorship by the Company.

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