Job Information
Corning Technical Specialist - Wiresaw Wafer Slicing in Hemlock, Michigan
*Date: *Dec 23, 2024
Location: Hemlock, MI, US, 48626
*Company: *Corning
Requisition Number: 66267
Corning is vital to progress -- in the industries we help shape and in the world we share.
We invent life-changing technologies using materials science. Our scientific and manufacturing expertise, boundless curiosity, and commitment to purposeful invention place us at the center of the way the world interacts, works, learns, and lives.
Our sustained investment in research, development, and invention means we're always ready to solve the toughest challenges alongside our customers.
Corning's businesses are ever evolving to best serve our customers, industries, and consumers. Today, we accelerate and transform life sciences, mobile consumer electronics, optical communications, display, and automotive markets. We are changing the world with:
- Trusted products that accelerate drug discovery, development, and delivery to save lives • Damage-resistant cover glass to enhance the devices that keep us connected • Optical fiber, wireless technologies, and connectivity solutions to carry information and ideas at the speed of light • Precision glass for advanced displays to deliver richer experiences • Auto glass and ceramics to drive cleaner, safer, and smarter transportation
Purpose of the Position:
In this role, you will be responsible for providing technical leadership and expertise in diamond-coated wire (DCW) wiresaw wafer slicing process, ensuring the production of high-quality solar wafer products.
*Key Responsibilities: *
- Serve as the primary technical expert resource for wiresaw wafer slicing processes, including parameter optimization, wire selection, and maintenance, to ensure the production of high-quality wafers.
- Identify opportunities for process optimization to improve yield, reduce costs, and enhance overall efficiency in wiresaw wafer slicing operations.
- Develop and implement robust quality control measures to ensure the highest standards of wafer quality are maintained, including thickness uniformity, surface roughness, and defect density.
- Lead efforts to troubleshoot technical issues related to wiresaw slicing, identify root causes, and implement corrective actions to address process deviations and improve process reliability.
Provide technical training and mentorship to engineering and manufacturing personnel to enhance their skills and knowledge in wiresaw slicing processes and techniques.
Required Education, Skills and Experience:
- Bachelor's degree or higher in engineering, materials science, or a related field.
- 10+ years of experience in Solar or Semiconductor wafer manufacturing or a closely related field, with a proven track record of technical leadership and expertise.
- In-depth knowledge of solar or semiconductor wafer manufacturing processes, equipment, and materials.
Strong analytical and problem-solving skills, with the ability to identify root causes of technical issues and implement effective solutions.
Desired Skills:
Stay informed about emerging technologies and advancements in wiresaw slicing techniques, equipment, and materials, and evaluate their potential impact on process performance and product quality.
Collaborate closely with R&D, engineering, operations, and quality assurance teams to drive cross-functional initiatives and resolve technical challenges related to wiresaw slicing.
Maintain accurate documentation of wiresaw slicing processes, procedures, and technical specification