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onsemi (NCG 2024 Q3) ENGR I, PROCESS INTEGRATION_TL in Bucheon-si, South Korea

  1. Job Description

  2. Process integration for next generation SiC MOSFET/ DIODE

  3. Experienced HV Silicon or SiC process integration engineer for device development

  4. Yield analysis regarding SiC material defects and fab defects

  5. Drive new tool decision together with fab, UPD, Process, and Equipment team

  6. Correlation analysis between PCM and in-line data

  7. Process simulation to verify the new SiC process

  8. New process module development (STM, RDL, RDL-OS, Visual failure)

  9. Planning and managing of engineering lots and

  10. DOE planning to implement the new idea into the experiment and do the evaluation and analysis

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