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onsemi [intern] PKG INTERN for Q3 2024 in Bucheon-si, South Korea

  • Concept and development of new package design

  • Manufacturing Review, Design Rules Review, worksheet documentation

  • Design for requirements

  • Start and maintain Design FMEA for package platform

  • Conduct DOE and process, material characterization, and robustness research

  • drawing/documentation/Marking and Bonding Diagrams, BOM

  • Establish process flow and important/new control plan

-Package development documentation

  • Review package feasibility including simulation, proof of concept, technology demonstration and technology release phase

  • Prototype/concept design and engineering builds support

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